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Dual-Head High-Frequency IC Test Probe | jiatel Customizable for Fine Pitch

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jiatel IC Spring Test Probes – Precision Testing for Integrated Circuits

 

Elevate your IC chip and high-precision electronic device testing with jiatel’s advanced IC Spring Test Probes. Engineered for reliable connections and stable signal transmission, these probes are the epitome of accuracy and durability in semiconductor testing. Whether you’re dealing with fine-pitch ICs, demanding high-frequency measurements, or seeking probes for extensive burn-in testing, jiatel delivers the superior performance required for critical quality assurance.


Why jiatel IC Spring Test Probes Are Unmatched for IC Testing:

 

jiatel’s IC Spring Test Probes are meticulously designed with unique features that set them apart for integrated circuit testing:

  • Dedicated IC Chip Testing: Specifically engineered for IC chip testing, ensuring reliable IC connections and optimal performance validation for various integrated circuits.
  • Precision and Ultra-Long Use: Classified as a high-precision probe, it boasts unique craftsmanship that guarantees accuracy in testing and is designed for ultra-long use, providing exceptional durability.
  • Double-Headed & Dual-Action Design: Features an innovative double-headed probe design that allows for precise docking and a dual-action structure, providing flexible application and robust contact for complex test scenarios.
  • Superior Signal Integrity: Possesses strong anti-interference ability, ensuring stable output and signal clarity crucial for sensitive IC measurements, including high-frequency IC testing up to 2 GHz.
  • Customizable for Diverse Needs: Offers extensive customization options in probe length (5mm to 150mm), tip diameter (0.1mm to 0.5mm), plunger tip shape (Sharp, Flat, Round, Crown, Cone), barrel diameter, and pitch (0.4mm to 1.5mm), making it ideal for fine-pitch IC testing and various IC packages like BGA test probes.
  • High Durability & Reliability: With a remarkable durability of 10,000 to 2 million cycles, these probes are built for longevity, minimizing replacement costs and maximizing uptime in automated test equipment (ATE).
  • Robust Electrical Performance: Customizable voltage (3.3V-100V) and current (1A-5A) ratings, ensuring reliable performance across a range of electrical tests. Contact resistance of ≥ 15 mΩ (customizable) and insulation resistance > 1 GΩ support accurate readings.
  • Wide Operating Temperature: Functions reliably across a wide operating temperature range of -40°C to +150°C, suitable for demanding environments including IC burn-in testing.
  • Premium Material & Finishing: Plunger tips in tungsten steel or gold-plated tungsten, barrels in stainless steel, beryllium copper, or brass, and springs in stainless steel, music wire, or phosphor bronze. Various optional finishing (Gold, Silver, Nickel, Platinum, etc.) enhance performance and corrosion resistance.

 

Key Specifications: jiatel IC Spring Test Probes

 

Attribute Specification
Product Type IC Spring Test Probe
Type Dual-Head Dual Move Probe
Application Testing IC Chips & High-Precision Electronic Devices
Probe Length 5 mm to 150 mm (Customizable)
Tip Diameter 0.1 mm to 0.5 mm (Customizable)
Plunger Tip Shape Sharp, Flat, Round, Crown, Cone (Customizable)
Barrel Diameter 0.5, 0.6, 0.8, 1.0, 1.2, 1.5, 2.0, 2.5, 3.0 mm (Customizable)
Contact Resistance ≥ 15 mΩ (Customizable)
Operating Temp. -40°C to +150°C
Voltage Rating 3.3V to 100V (Customizable)
Current Rating 1A to 5A (Customizable)
Frequency < 2 GHz
Pitch 0.4 mm to 1.5 mm (Customizable)
Durability 10,000 to 2 Million Cycles
Plunger Tip Material Tungsten Steel, Gold-Plated Tungsten, Stainless Steel (Optional)
Barrel Material Stainless Steel, Beryllium Copper, Brass (Optional)
Spring Material Stainless Steel, Music Wire, Phosphor Bronze (Optional)
Finishing Gold (Au), Silver (Ag), Nickel, Platinum (Pt), Rhodium (Rh), Ruthenium (Ru), Palladium (Pd), Tungsten (W), Titanium (Ti), Chrome (Cr) (Optional)
Brand jiatel

 

Comprehensive Applications in Semiconductor Testing:

 

jiatel’s IC Spring Test Probes are indispensable tools across the semiconductor industry for:

  • IC Chipset Testing: Core application for verifying the functionality and integrity of various IC chips, including CPU test probes and memory test probes.
  • Burn-in Sockets: Designed for burn-in test probes, ensuring reliable contact during accelerated aging tests.
  • Wafer Probing: Suitable for wafer test probes that demand high precision for initial silicon validation.
  • Fine Pitch PCB Testing: The customizable tip diameter and pitch make them ideal for fine-pitch PCB testing and BGA package testing.
  • High-Frequency Testing: Supports testing of high-speed ICs and communication components requiring high-frequency probes.
  • Automated Test Equipment (ATE): Seamlessly integrates into ATE systems for efficient, automated IC testing.
  • Quality Control & R&D: Essential for both production quality control and research & development in semiconductor manufacturing.

 

jiatel: Your Partner for IC Test Excellence

 

When precision, reliability, and customizability are paramount for your IC and semiconductor testing needs, jiatel’s IC Spring Test Probes are the superior choice. With their advanced features, robust construction, and ability to handle diverse test applications, they are designed to optimize your testing processes and ensure the highest quality for your integrated circuits. Trust jiatel for high-performance IC test pins that empower your semiconductor validation.

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