Keystone 1056 Equivalent Through-Hole 1220 Coin Cell Battery Holder

Low-Profile DIP 90° Through-Hole 1220 Coin Cell Retainer | 1:1 Drop-In Replacement for Keystone 1056 THM Layout

We engineered the through-hole single-piece configuration of the JT-BH-1220-KS1056-THM series to provide rugged mechanical board-level anchoring for industrial power supplies, main control boards, and vehicle tracking hardware. Featuring robust 3.00mm solder tails designed for stable wave soldering, this DIP 90° architecture resists high extraction stress while maintaining a low-profile vertical envelope on the PCB upper plane.

• High-Reliability Circuit Continuity: Precision-stamped Phosphor Bronze contact arms sustain uniform contact pressure across continuous temperature variations from -25°C to +85°C. This prevents micro-intermittent power cuts common in rugged environments, stabilizing real-time clock (RTC) configurations.
• Direct Downstream Business Value: True form-fit-function alignment with industry-standard patterns allows immediate BOM (Bill of Materials) substitution, completely removing board redesign bottlenecks or tooling modification costs during NPI engineering.

Symmetrical Orientation Customization for High-Density PCB Packing

To eliminate manual trace jumper lines and unnecessary trace deviations on complex double-sided boards, this through-hole series is split into mirrored pin configurations based on your technical drawing selections:

• Forward-Facing DIP Layout (Standard Polarity Symmetry): Optimized for standard linear board paths where circuit traces exit downstream along the primary assembly axis. (Specify drawing selection option -SP-F).
• Reverse-Facing DIP Layout (Mirrored Polarity Symmetry): Configured as a mirrored physical footprint to allow balanced dual-cell placements or dense backplane component arrays. (Specify drawing selection option -SP-R).

Rigid Material Formulation & Metallurgical Finish Options

To satisfy varying environmental exposure limits and cost targets, our manufacturing line supports a fully scalable ordering matrix using your standardized drawing callouts:

• Insulation Polymer Options: Standard builds utilize rugged PBT Black (Code 1A) or PA66 Black (Code 1B). For higher-temperature environments, layouts can be custom ordered in PPA Brown (2A), PPA Black (2B), PPS Brown (3A), PPS Black (3B), LCP White (4A), or LCP Black (4B) rated at UL 94V-0.
• Terminal Plating Specifications: Contacts can be specified with pure Tin Plating Sn 100u”-120u” (Code K) for reliable wave soldering joints, or specialized Gold Flash Au 1u” (Code A) for low-impedance connections in high-reliability applications.

Official Custom Configuration Matrix

Footprint Layout Verification & Senior NPI Engineering Queue

Because through-hole pin configurations require precise drill hole pad clearance tolerances (3-ø0.95 and 2-ø1.00 layout parameters) to guarantee solid capillary solder action, we do not allow direct web downloads of 3D step logs. Our engineering team supplies verified verification drawings instead. Send your exact board layout requirements to our technical portal to prompt our Senior NPI Engineering Team for a 1:1 cross-reference check.

Route your validation files through this channel:
Request Engineering Support

SLA Fulfillment Commitment: We officially guarantee to deliver verified, production-ready [Technical Datasheets] and [2D Footprint Specs] in PDF format within 12 hours after registration in our NPI Engineering Queue.

Compliance & Environmental Reliability Addendum

• Global Environmental Standards: Fully RoHS & REACH compliant, meeting strict material criteria for North American and European industrial machinery markets.
• Extended Thermal Operating Envelope: Operational and stable across an industrial temperature range from -25°C to +85°C.
• Corrosion Resistance: High-purity base nickel underplating prevents oxidation and contact impedance drift over extended field storage cycles.