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THM Battery Clip (AAA/N/A23) | Keystone 82 Alternative

Direct Footprint Replacement for Keystone 82 THM Clips

We engineered this board-level battery clip. It serves as a 1:1 footprint replacement for Keystone 82. This THM clip features dual solder pins. It provides secure retention for AAA, N, and A23 cells.

  • Mounting Architecture: Through-Hole Mount (THM) with Dual Pins
  • Cell Compatibility: AAA, N, A23 (Cylindrical Cells)
  • Dimensional Envelope: 9.90mm Width x 9.92mm Height
  • PCB Pad Layout: Direct Match for Keystone 82 (8.10mm Lateral Pitch)
  • Metallurgy: T=0.25mm Spring Steel finished with Nickel Plating

Engineering Datasheet: THM Battery Clip, Direct Footprint Replacement for Keystone 82

Securing cylindrical cells on FR4 boards demands extreme retention force. Wave soldering turbulence requires absolute THM pin coplanarity. The Jiatel JT-BC-AA-KS82 is a direct footprint replacement for Keystone 82. This clip features a U-channel gripping architecture. It utilizes dual downward solder tails. You can execute seamless board-level power integration. You do not need to alter existing PCB drill hole coordinates.

Verified Board-Level Parameters

Target Cross-Reference Direct Footprint Replacement for Keystone 82
Mounting Architecture Through-Hole Mount (THM) Dual Pin
Lateral Pin Pitch 8.10±0.25mm Spread (Requires Ø1.90mm Drills)
Axial PCB Pitch (“L” Dim) 27.55mm (AAA) | 12.15mm (N) | 11.15mm (A23)
Base Metallurgy T=0.25mm Spring Steel | Nickel Plated

Target Deployments

  • Industrial IoT: Ruggedized sensor nodes requiring vibration resistance.
  • Medical Diagnostics: PCB-mounted patient monitoring modules.
  • Consumer Electronics: High-drain devices requiring THM stability.

Metallurgical Rigidity & Solder Joint Integrity

We stamp the JT-BC-AA-KS82 from high-yield T=0.25mm Spring Steel. This specific formulation guarantees absolute structural rigidity. The U-channel gripping arms prevent cell dislodgement during mechanical impact. The clip will not yield under repeated battery insertion cycles. We finish the assembly with high-density Nickel Plating. This maximizes wave solder wettability on the 1.60mm wide THM pins. It eliminates the risk of cold solder joints.

NPI PCB Footprint Audit & SLA Directive

Board-level integration demands strict adherence to pin pitch dimensions. Layout errors cause THM misalignment and wave soldering failures. Our engineering rules strictly prohibit the distribution of unverified digital mockups. We execute structural footprint validation exclusively through official [Technical Datasheets]. We rely on dimensionally controlled [2D Footprint Specs].

Confirm that our THM clip matches your existing FR4 land pattern. Submit your board constraints directly to our technical desk: NPI Engineering Queue. We will dispatch matched, production-ready PDF drawings within 12 working hours.

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