Form-Fit Mechanical Replacement for 8.7mm Extra-Long DIP Pins
Electronic architectures featuring multi-layer stacked boards or elevated component modules with variable mating gaps require interconnects that provide extended reach, high compression tolerance, and absolute mechanical retention. The Jiatel 1.8×8.7mm series functions as a 1:1 mechanical drop-in alternative for extra-long legacy through-hole pogo pins. By anchoring directly into the PCB plated through-holes, this extended DIP configuration aggressively resists the amplified lateral shear forces inherent in taller interconnects. The generous 1.5mm compression stroke dynamically absorbs board-to-board co-planarity variations and severe vibration, ensuring an unbroken 1A to 1.5A continuous electrical path.
Verified Technical Metrics
| Mechanical Profile | Ø 1.8mm Barrel | 8.7mm Extended Resting Height |
| Deflection Stroke | 1.5mm Working Travel (High Tolerance) |
| Electrical Path Capacity | DC 12V / 1.0A to 1.5A Continuous Load |
| Contact Resistance | ≤ 30mΩ Initial Maximum |
| Thermal Profile Resilience | -40°C to +150°C Operational Range |
Target THT Deployments
- Modular Battery Systems: Deep-reach power distribution units.
- Heavy Equipment: High-vibration industrial automation controls.
- Automotive Electronics: Spaced-board internal vehicular routing.
- Smart Grid Utilities: Durable outdoor device junctions.
Material Science Under Thermal Extremes
Extended 8.7mm barrel lengths coupled with a deep 1.5mm stroke present unique challenges in maintaining internal spring alignment and consistent electrical resistance. To prevent internal binding and signal degradation under full compression, the turned plunger and barrel are fabricated from optimized brass alloys protected by a heavy gold-plated layer over a nickel diffusion barrier. This surface engineering hardens the contact point against friction and maintains the mechanical integrity of the internal spring across 10,000 mating cycles. Explicitly tested to sustain performance up to 150°C, this high-temperature rating prevents pin seizing within dense, multi-layer power enclosures.
NPI Footprint Auditing & Verification Queue
Through-hole wave soldering for extra-long components requires strict control over pin pitch and vertical coplanarity to prevent angular tilt and mating misalignment. We enforce tight CNC turning tolerances to eliminate insertion errors on multi-layer boards. We bypass the integration risks associated with unverified digital mockups by anchoring our validation process exclusively on official [Technical Datasheets] and dimensionally verified [2D Footprint Specs].
To confirm that our 1.8×8.7mm barrel configuration integrates seamlessly into your stacked board layout without causing tilt or hole clearance friction, our Senior NPI Engineering Team executes comprehensive structural audits. To initiate a cross-reference evaluation, submit your terminal layout to our engineering desk: NPI Engineering Queue
SLA Commitment: Upon form submission to our NPI Engineering Queue, we guarantee the delivery of matched, production-ready PDF drawings within 12 working hours.
