High-Current SMT Contact Pads: 6A Rated, 0.15mΩ Max Resistance
Jiatel’s Gold Plated Contact Pads (also known as Pogo Pin Targets or SMT Surface Mount Contacts) are engineered to provide a stable, low-resistance interface for spring-loaded connectors. Designed for high-frequency mating, our pads feature premium C3604 Brass or Beryllium Copper with precision Gold plating (up to 30u”), ensuring over 100,000 cycles of reliable connectivity.
In 5G and fast-charging applications, high resistance causes heat. Our precision CNC machining and 3u” minimum gold plating ensure maximum thermal efficiency and zero signal drop-out.
SMT Contact Pad Selection Matrix
Choose from our standard profiles or request a custom geometry tailored to your PCB layout. All standard shapes are packaged in Tape & Reel for automated assembly.
| Shape | Min/Max Thickness | Material Options | Typical Application |
|---|---|---|---|
| Round | 0.2mm – 1.0mm | Brass / BeCu | General Pogo Pin Landing, TWS Earbuds |
| Rectangle / Square | 0.2mm – 1.0mm | Brass / BeCu | High-Current Charging, Smartwatches |
| Oval | 0.2mm – 1.0mm | Brass / BeCu | Space-constrained PCB layouts |
| Concave (Dimpled) | 0.3mm – 1.0mm | Brass / BeCu | High-vibration environments (Centers the pin) |
| Custom Geometry | Custom | Brass / BeCu / Bronze | Medical diagnostics, Industrial handhelds |
Not sure which thickness or material to choose?
Describe your application (e.g., TWS, Medical, High-Current) and our engineering team will recommend the optimal SMT pad design within 12 hours.
Technical Specifications & Industry Comparison
We consolidated our testing data to show why Jiatel outlasts generic market alternatives.
| Parameter | Jiatel Standard Specification | Industry Average |
|---|---|---|
| Base Material | C3604 Brass / Beryllium Copper (C17200) | Generic Brass |
| Plating Thickness | 3u” – 30u” Gold over Nickel | Gold Flash (0.1u”) |
| Contact Resistance | ≤ 0.15 mΩ | ≤ 50 mΩ |
| Rated Current | Up to 6A | 1A – 2A |
| Mechanical Life | 100,000+ Cycles | 10,000 – 20,000 Cycles |
| Surface Smoothness | Ra < 0.4μm | Ra > 0.8μm |
Jiatel vs. Global Brands (Molex/TE Connectivity)
- Customization: High flexibility with Low/No MOQ for prototypes, unlike international giants that require massive volume.
- Lead Time: 2-3 weeks compared to the industry standard of 16-24 weeks.
- Technical Support: 12-hour DFM analysis and direct engineering communication.
- Manufacturing Ready: Supplied in Tape & Reel packaging, supporting reflow soldering up to 260°C. 100% RoHS Compliant (2015/863/EU).
Frequently Asked Questions (FAQ)
- Q: Why is gold plating essential for pogo pin contact pads?
A: Gold provides superior conductivity and oxidation resistance. Jiatel’s controlled plating thickness ensures the contact resistance remains low even after thousands of cycles. - Q: Can you provide contact pads in custom shapes?
A: Yes, we specialize in CNC and stamping for square, circular, and even concave pads designed to center the pogo pin plunger. - Q: Why is the 0.15mΩ contact resistance significant for my design?
A: In high-current applications (up to 6A), even minor resistance can lead to significant heat buildup and power loss. Our precision-machined pads ensure superior thermal management and stable power delivery. - Q: What is the standard seating height of Jiatel SMT contact pads above the PCB?
A: Our standard low-profile contact pads sit 0.10mm above the PCB surface, optimized for high-density SMT assemblies while saving vertical space. - Q: Are these contact pads compatible with automated SMT reflow soldering?
A: Absolutely. They are engineered to withstand lead-free reflow soldering temperatures of up to 260°C for 10 seconds without discoloration or deformation. - Q: Can I request custom shapes or 3D technical documentation?
A: Yes. We offer full DFM support for custom shapes to fit your specific PCB layout. Technical datasheets and 3D STEP files are available to help accelerate your CAD design process.


