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THM Battery Clip (18650/CR123A) | Keystone 54 Alternative

Direct Footprint Replacement for Keystone 54 THM Clips

We engineered this board-level battery clip. It serves as a 1:1 footprint replacement for Keystone 54. This THM clip features a 3-pin solder tail architecture. It provides secure retention for heavy 18650 and CR123A lithium cells.

  • Mounting Architecture: Through-Hole Mount (THM) with 3 Pins
  • Cell Compatibility: 18650, CR123A (Cylindrical Cells)
  • Dimensional Envelope: 16.69mm Width x 16.60mm Height
  • PCB Pad Layout: Direct Match for Keystone 54 (5.08mm Pin Pitch)
  • Metallurgy: T=0.35mm Spring Steel finished with Nickel Plating

Engineering Datasheet: THM Battery Clip, Direct Footprint Replacement for Keystone 54

Securing heavy 18650 lithium cells on FR4 boards demands extreme retention force. Wave soldering turbulence requires absolute THM pin coplanarity. The Jiatel JT-BCKS54-NI is a direct footprint replacement for Keystone 54. This clip features a heavy-duty U-channel gripping architecture. It utilizes three downward solder tails. You can execute seamless board-level power integration. You do not need to alter existing PCB drill hole coordinates.

Verified Board-Level Parameters

Target Cross-Reference Direct Footprint Replacement for Keystone 54
Mounting Architecture Through-Hole Mount (THM) 3-Pin
Lateral Pin Pitch 5.08mm Spread (Requires Ø1.80mm Drills)
Axial PCB Pitch (“L” Dim) 46.50mm (18650) | 14.50mm (CR123A)
Base Metallurgy T=0.35mm Spring Steel | Nickel Plated

Target Deployments

  • Energy Storage: Battery management system (BMS) boards utilizing 18650 cells.
  • Medical Diagnostics: PCB-mounted power modules for portable equipment.
  • Industrial IoT: High-drain ruggedized devices requiring THM stability.

Metallurgical Rigidity & Solder Joint Integrity

We stamp the JT-BCKS54-NI from heavy-gauge T=0.35mm Spring Steel. This specific formulation guarantees absolute structural rigidity. The 16.60mm high gripping arms prevent cell dislodgement during mechanical impact. The clip will not yield under repeated battery insertion cycles. We finish the assembly with high-density Nickel Plating. This maximizes wave solder wettability on the three 1.56mm wide THM pins. It eliminates the risk of cold solder joints.

NPI PCB Footprint Audit & SLA Directive

Board-level integration demands strict adherence to pin pitch dimensions. Layout errors cause THM misalignment and wave soldering failures. Our engineering rules strictly prohibit the distribution of unverified digital mockups. We execute structural footprint validation exclusively through official [Technical Datasheets]. We rely on dimensionally controlled [2D Footprint Specs].

Confirm that our THM clip matches your existing FR4 land pattern. Submit your board constraints directly to our technical desk: NPI Engineering Queue. We will dispatch matched, production-ready PDF drawings within 12 working hours.

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