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THM Coin Cell Retainer (CR1220/CR1225) | Keystone 3001 Alternative

Direct Footprint Replacement for Keystone 3001 THM Retainers

We engineered this through-hole coin cell retainer. It serves as a 1:1 footprint replacement for Keystone 3001. Unlike SMT variants, this THM clip utilizes dual downward pins to provide superior mechanical retention on the PCB. It secures Ø12.5mm micro coin cells, accommodating CR1220 and CR1225 lithium batteries.

  • Mounting Architecture: Through-Hole Mount (THM)
  • Cell Compatibility: CR1220, CR1225, BR1220, BR1225 (Ø12.5mm)
  • Dimensional Envelope: 12.07mm Width x 14.87mm Length x 5.27mm Height
  • Axial Pin Pitch: Direct Match for Keystone 3001 (13.21mm Span)
  • Metallurgy: T=0.25mm Phosphor Bronze finished with Nickel Plating
Jiatel P/N

JT-BC1220-PC2

Battery Compatibility 

CR1220

PCB Mount Orientation

Horizontal

Mounting

Through-hole

Material

Phosphor Bronze

Surface Plating

Nickle 100μ“

Package

Bag

Engineering Datasheet: THM Coin Cell Retainer, Direct Footprint Replacement for Keystone 3001

Securing micro coin cells in high-vibration environments requires robust through-hole integration. The Jiatel JT-BC-1220-KS3001 is a direct footprint replacement for the Keystone 3001. Unlike the SMT 3000 variant, this retainer deploys a dual-pin THM architecture. It provides extreme resistance against lateral shear forces. You can execute seamless board-level integration for CR1220 and CR1225 backup cells. You do not need to alter existing PCB drill hole coordinates.

Verified Board-Level Parameters

Target Cross-Reference Direct Footprint Replacement for Keystone 3001
Mounting Architecture Through-Hole Mount (THM) Dual Pin
Axial Pin Pitch 13.21mm Spread (Requires 2-Ø1.85mm Drills)
Negative Pad Constraint 4.00mm Square Minimum (Center Pad)
Base Metallurgy T=0.25mm Phosphor Bronze | Nickel Plated

Target Deployments

  • Industrial Controllers: Heavy-duty PLC modules requiring wave-soldered RTC backup.
  • Server Motherboards: High-density data center hardware demanding maximum terminal retention.
  • IoT Infrastructure: Outdoor sensor nodes exposed to environmental shock.

Metallurgical Rigidity & Wave Soldering Integrity

We stamp the JT-BC-1220-KS3001 from rigid T=0.25mm Phosphor Bronze. The top clamping arms maintain continuous pressure on the CR1220/CR1225 cells, preventing voltage drop during mechanical impact. We finish the THM tails with high-density Nickel Plating. This maximizes wave solder wettability across the 13.21mm pin layout. It eliminates the risk of cold solder joints and physical detachment.

NPI PCB Footprint Audit & SLA Directive

Through-hole integration demands strict adherence to pin pitch dimensions and drill tolerances. Layout errors cause pin bending and wave soldering failures. Our engineering rules strictly prohibit the distribution of unverified digital mockups. We execute structural footprint validation exclusively through official [Technical Datasheets]. We rely on dimensionally controlled [2D Footprint Specs].

Confirm that our THM retainer matches your FR4 drill pattern. We must deploy our Senior NPI Engineering Team to ensure a 1:1 footprint replacement. Submit your board constraints directly to our technical desk: NPI Engineering Queue. We will dispatch matched, production-ready PDF drawings within 12 working hours.

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