Jiatel Electronics - Custom Pogo Pin and Wire Harness Manufacturer

Mill-Max 605 Alternative: 120-Pin PGA Carrier (Custom Gold Plating Available)

  • Contact Plating: 30μ” Gold (High Durability)

  • Options: 1μ”, 3μ”, 10μ” Gold available for cost optimization

  • Current Rating: 3 Amps

  • Pin Material: Beryllium Copper (BeCu)

  • Drawing: 3D STEP Files (Request via Email)
Current Rating

3A

Durability

100 Cycles

This pin array holder is the perfect 120-pin solution for high-density PGA applications.

General Info

Description : Reduced Barrel Receptacle Carrier
Type: PGA
Category: Pin Grid Array Carrier
Mounting Style: Through Hole Solder Mount
Pins: 120
Packaging : Packaged in Box or Tube
ECCN: EAR99
HTSUS: 8536.90.4040
Product Lifecycle: Active

Materials

Loose Pin/Receptacle (Material): 0548 (Brass Alloy)
Shell Plating: 10 μ” Gold over 100 μ” Nickel
Inner Contact : 21
Contact Fingers: 3
Inner Contact Material: Beryllium Copper
Inner Contact Plating: 30 μ” Gold over 50 μ” Nickel
Insulator Material: High Temp Thermoplastic

Environmental Specs

Temperature Range : -55/+125° C
Shock : No Elect. Discontinuity > 1μs @ 50g
Vibration :No Elect. Discontinuity > 1μs @ 10-2000HZ, 15 G
RoHS : Yes
Moisture SensitivityLevel (MSL):1 (Unlimited)
REACH Status: REACH Unaffected

Mechanical Specs

Mechanical life (Durability): 100 Cycles Minimum

Electrical Specs

Current Rating : 3 Amps
Contact Resistance : 10 mΩ max.
Rated Voltage: 100 VRMS/150 VDC

 

605-13-pga

Flexible Plating Options for Your Budget While our standard Mill-Max 605 equivalent features 30μ” Gold Plating for maximum reliability in military and aerospace applications, Jiatel offers flexible manufacturing. To meet today’s market demands and optimize your costs, we can provide this PGA carrier with 1μ”, 3μ”, or 10μ” gold plating without compromising the mechanical integrity of the Beryllium Copper contacts.

Why choose Jiatel? > Whether you need the extreme durability of 30μ” or the cost-effectiveness of 1μ” for consumer electronics, our Ra < 0.4μm surface finish ensures a smooth, low-insertion-force connection every time.

High-Precision PGA Carrier Solution Jiatel’s PGA Grid Array Carriers provide a reliable, low-profile interface for high-density pin array applications. Designed as a robust alternative to the Mill-Max 605 series, our carriers feature precision-machined brass shells and Beryllium Copper inner contacts for maximum conductivity.

Why Engineers Specify Jiatel PGA Carriers:

  • Superior Contact Integrity: 30μ” gold plating on the inner contact fingers ensures stable, low-resistance connections (10 mΩ max) over 100+ mating cycles.

  • Thermal Stability: Built with high-temp thermoplastic insulators, operating reliably from -55°C to +125°C, ideal for wave soldering and demanding environments.

  • Industrial Durability: Tested for shock (50g) and vibration (15G) with no electrical discontinuity >1μs.

  • Compliance Ready: Fully compliant with RoHS-3 and REACH standards for global deployment.

Need a Custom Solution?

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