Quick answer: Connector housings for SMT reflow need a plastic that survives a 260°C peak without warping. LCP is specified for the thinnest walls and lowest warpage. PPS adds dimensional stability and inherent flame retardance for high-temperature service. High-temperature polyamide is chosen where low water absorption and blister resistance after reflow matter. PBT is the lowest-cost option for through-hole connectors; with a 205°C HDT it is not a reflow material.
Choosing the right connector housing material is the difference between a high-performance interconnect and a catastrophic field failure. In modern SMT manufacturing, selecting a plastic that can survive 260°C reflow while maintaining 0.01mm tolerances is critical.
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Polyamide (PA) — what the datasheets call “Nylon”
Polyamide is the polymer family; “Nylon” is its trade name. Connector datasheets use both, so the same material may appear as polyamide, PA, PA6, PA66, PA46, PA6T, PA9T or PA10T. Grade codes matter more than the label: water absorption in polyamides is set by amide group concentration, so long-chain high-temperature grades do not behave like general-purpose PA. Kuraray’s GENESTAR™ PA9T documents low water absorption, high heat resistance and blister suppression after reflow for the long-chain grade.
Grades commonly specified for connector housings:
- LCP — Celanese Vectra® / Zenite®
- PPS — Syensqo Ryton®
- High-temperature polyamide — Kuraray GENESTAR™ PA9T
- PBT — SABIC VALOX™
Grades commonly specified for connector housings include LCP (e.g. Vectra), PPS (e.g. Ryton), high-temperature polyamide (e.g. Genestar PA9T) and PBT (e.g. Valox). Tell us the grade you already use and we will hold the same base resin rather than substituting an unqualified equivalent.
Common Connector Plastic Materials: A Comparative Analysis
Jiatel utilizes high-grade engineering plastics—including Nylon (PA6T/PA9T), PBT, PPS, and LCP—to manufacture precision components. Each material is selected based on its mechanical strength, dielectric properties, and thermal resistance.
1. High-Temperature SMT Plastics (LCP & PPS)
- LCP (Liquid Crystal Polymer): The “Gold Standard” for high-speed USB Connectors and micro-pitch Board-to-Board interfaces. It offers near-zero warping, exceptional flow for thin-walled parts, and resists temperatures up to 280°C.
- PPS (Polyphenylene Sulfide): Exceptional chemical resistance and dimensional stability. Ideal for battery holders and automotive sensors where exposure to harsh chemicals or long-term heat is expected. Note: PPS documents exceptionally high modulus and creep resistance; consult our DFM team for shock- and vibration-critical applications.
2. Mechanical Toughness (Nylon/PA)
- Nylon (PA66, PA46, PA9T): Known for high mechanical strength and flexibility. We use High-Temperature Nylon (HTN) for Spring Loaded Connectors (Pogo Pins) because it provides the necessary toughness for repeated mating cycles while handling SMT heat.
3. Cost-Effective Through-Hole Solutions (PBT)
- PBT (Polyester): The go-to material for traditional DIP (Through-hole) connectors like 2.54mm pin headers. It is highly cost-effective and dimensionally stable but cannot withstand SMT reflow temperatures.
Technical Comparison Matrix: Housing Material Selection
| Feature | LCP | PPS | HT Nylon (PA6T/PA9T) | PBT |
|---|---|---|---|---|
| Max Process Temperature (Peak, JEDEC J-STD-020) | 280°C+ | 260°C | 260°C | 220°C |
| HDT @ 1.8 MPa (ISO 75) | 275°C | 265°C | 260°C | 205°C |
| Reflow capable | Yes (JEDEC J-STD-020) | Yes | Yes | No (Wave Soldering Only) |
| Warping Resistance | Excellent | Good | Moderate | Low |
| Wall Thickness | Ultra-Thin | Standard | Standard | Thick |
| CTE (flow direction) | ~15 ppm/°C | ~22 ppm/°C | ~20 ppm/°C | ~30 ppm/°C |
| Dk / Df @ 1 GHz | 3.2 / 0.003 | 3.5 / 0.002 | 3.1 / 0.015 | 3.3 / 0.020 |
| Water absorption | < 0.02% | < 0.02% | ~0.17% | ~0.08% |
| UL94 flammability | UL 94V-0 | UL 94V-0 | UL94 HB (V-0 grades available on request) | UL94 HB (V-0 grades available on request) |
| Relative Cost | High | Medium | Medium | Low |
Related reading: Pogo pin types and termination options — SMT, through-hole and solder-cup terminations compared for the same reflow constraints discussed above.
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Frequently Asked Questions: Connector Housing Materials
What is the difference between polyamide and nylon in connectors?
Nylon is the trade name for the polyamide (PA) polymer family. Connector datasheets use both terms, plus grade codes such as PA66, PA46, PA6T and PA9T. The codes denote different polyamide chemistries rather than a quality ranking. Kuraray documents low water absorption and blister suppression after reflow for its long-chain PA9T grade.
Which connector plastic survives lead-free reflow at 260°C?
LCP (280°C+) and PPS (260°C) are the standard choices. High-temperature polyamides (PA6T/PA9T) are also used. PBT cannot withstand SMT reflow and is limited to through-hole (DIP) connectors.
Why do connectors warp during reflow, and how do I prevent it?
Two levers matter: wall thickness and material choice. Celanese documents LCP for thin-walled parts that must survive high-heat exposure, with low warpage and little or no shrinkage in the flow direction. Thicker walls and lower-flow materials reduce the process window.
LCP vs PPS — which should I choose?
LCP is the thin-wall, low-warpage choice and is documented for the thinnest sections with the lowest warpage — a fit for high-speed USB and micro-pitch board-to-board. PPS brings exceptionally high modulus, creep resistance, chemical resistance comparable to PEEK and fluoropolymers, and inherent non-flammability without additives — a fit for battery holders and high-temperature service parts.
Is PBT suitable for SMT connectors?
No. PBT’s peak process temperature is 220°C and its HDT @ 1.8 MPa is 205°C, both below the lead-free reflow window; its warping resistance is the lowest of the four materials above. It is the right choice for through-hole (DIP) parts such as 2.54mm pin headers.
How do I get a material recommendation for my design?
Send your drawing and reflow profile for a DFM review. We return a material recommendation with the selection rationale for your specific assembly process.
