Surface Mount Architecture for Multi-Cell Power
Integrating battery contacts directly onto high-density printed circuit boards necessitates components with superior reflow stability and precise pad geometries. The JIATEL JT-BC-AAA-1076P is deployed as a direct footprint replacement for the Keystone 1076. Engineered with a specialized 90° bent soldering tab, this positive (male) contact eliminates manual wiring, enabling hardware engineers to execute fully automated SMT pick-and-place assembly for diverse cell formats including AAA, AAAA, N, A23, and A27 batteries.
| Technical Parameter | Verified Specification |
|---|---|
| Target Cross-Reference | Direct SMT Footprint Replacement for Keystone 1076 |
| Terminal Assignment | Positive Anode (Central Stamped Dimple) |
| PCB Solder Pad | 6.35 mm x 5.08 mm (with 3.43 mm x 1.57 mm slot) |
| Material Core | T=0.30 mm Stainless Steel |
Thermal Stability & Automated Integration
We stamp this multi-cell contact from highly rigid 0.30 mm stainless steel to withstand the thermal stress of standard lead-free reflow profiles. The high-density nickel plating maximizes solder paste wettability on the 6.35 mm base pad, preventing tombstoning or cold joints during automated oven processing. The central dimple is precisely calibrated to secure constant electrical continuity against the positive terminals of AAA, AAAA, N, A23, and A27 cylindrical cells.
SMT footprint mismatches result in critical reflow soldering defects. Our operational directives strictly prohibit the unauthorized distribution of unverified 3D CAD data to ensure assembly success. Verify your PCB land patterns by engaging our senior engineering team directly. Submit your layout parameters to our Request Engineering Support desk. We guarantee the dispatch of official 2D Footprint Specs and production PDFs within 12 working hours.
