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SMT Coin Cell Retainer (CR2430) | Keystone 3006 Alternative

Direct Footprint Replacement for Keystone 3006 SMT Retainers

We engineered this surface-mount coin cell retainer. It serves as a 1:1 footprint replacement for Keystone 3006. This SMT clip secures Ø24.0mm coin cells. It accommodates CR2430 lithium batteries for automated PCB reflow lines.

  • Mounting Architecture: Surface Mount Technology (SMT)
  • Cell Compatibility: CR2430 (Ø24.0mm)
  • Dimensional Envelope: 23.33mm Width x 35.56mm Length x 3.99mm Height
  • PCB Pad Layout: Direct Match for Keystone 3006 (35.56mm Span)
  • Metallurgy: T=0.25mm Phosphor Bronze finished with Nickel Plating

Engineering Datasheet: SMT Coin Cell Retainer, Direct Footprint Replacement for Keystone 3006

Securing wide Ø24.0mm coin cells on high-density FR4 boards requires precise SMT pad layout matching and high terminal retention force. The JIATEL JT-BC-2430-KS3006 is a direct footprint replacement for the Keystone 3006. This retainer allows hardware engineers to execute seamless board-level integration for high-capacity CR2430 backup cells. You do not need to alter existing PCB pad coordinates or reflow solder stencil designs.

Verified Board-Level Parameters

Target Cross-Reference Direct Footprint Replacement for Keystone 3006
Mounting Architecture Surface Mount Technology (SMT)
Outer Pad Span 35.56mm Minimum Span
Negative Pad Constraint 4.00mm Square Minimum (Center Pad)
Base Metallurgy T=0.25mm Phosphor Bronze | Nickel Plated

Target Deployments

  • Industrial IoT: High-capacity RTC backup power for remote sensor gateways.
  • Medical Devices: Long-life portable diagnostics and drug delivery systems.
  • Consumer Electronics: Smart home controllers requiring CR2430 primary power.

Metallurgical Rigidity & Solder Joint Integrity

We stamp the JT-BC-2430-KS3006 from rigid T=0.25mm Phosphor Bronze. This specific material formulation provides excellent spring fatigue resistance for wide 24.0mm cells. The dual clamping arms will not yield under constant battery insertion pressure or thermal cycling. We finish the entire assembly with high-density Nickel Plating. This maximizes solder paste wettability across the wide 35.56mm base span during SMT reflow. It eliminates the risk of cold solder joints and pad delamination.

NPI PCB Footprint Audit & SLA Directive

Board-level assembly demands strict adherence to pad dimensions and coplanarity limits. Layout errors cause reflow misalignment and battery seating failures. Our engineering rules strictly prohibit the distribution of unverified digital mockups. We execute structural footprint validation exclusively through official [Technical Datasheets]. We rely on dimensionally controlled [2D Footprint Specs].

Confirm that our SMT retainer matches your land pattern constraints. We must deploy our Senior NPI Engineering Team to ensure a 1:1 footprint replacement. Submit your parameters directly to our technical desk: NPI Engineering Queue. We will dispatch matched, production-ready PDF drawings within 12 working hours.

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