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SMT Coin Cell Retainer (LR44/SR44) | Keystone 2996 Alternative

Direct Footprint Replacement for Keystone 2996 SMT Retainers

We engineered this surface-mount coin cell retainer. It serves as a 1:1 footprint replacement for Keystone 2996. This SMT clip secures LR44, SR44, and A76 coin cells. We package this component in tape and reel for automated assembly.

  • Mounting Architecture: Surface Mount Technology (SMT)
  • Cell Compatibility: LR44, SR44, A76, 357 (Ø11.6mm)
  • Dimensional Envelope: 12.06mm Width x 17.78mm Length x 5.97mm Height
  • PCB Pad Layout: Direct Match for Keystone 2996 (17.78mm Span)
  • Metallurgy: T=0.25mm Phosphor Bronze finished with Nickel Plating

Engineering Datasheet: SMT Coin Cell Retainer, Direct Footprint Replacement for Keystone 2996

Securing thick coin cells on FR4 boards requires robust SMT pads. The Jiatel JT-BC-LR44-KS2996 is a direct footprint replacement for Keystone 2996. This micro retainer allows hardware engineers to execute seamless board-level integration. You do not need to alter existing PCB pad layouts. You can keep your current reflow solder stencil designs.

Verified Board-Level Parameters

Target Cross-Reference Direct Footprint Replacement for Keystone 2996
Mounting Architecture Surface Mount Technology (SMT)
Outer Pad Span 17.78mm Minimum Span
Negative Pad Constraint 4.00mm Square Minimum
Base Metallurgy T=0.25mm Phosphor Bronze | Nickel Plated

Target Deployments

  • Medical Diagnostics: Portable glucose monitors and hearing aids.
  • Consumer Electronics: Compact laser pointers and small handheld tools.
  • Industrial IoT: Miniaturized RTC backup power nodes.

Metallurgical Rigidity & Solder Joint Integrity

We stamp the JT-BC-LR44-KS2996 from rigid T=0.25mm Phosphor Bronze. This specific material provides excellent fatigue resistance. The top clamping arms will not yield under constant battery pressure. We finish the entire assembly with high-density Nickel Plating. This plating maximizes solder paste wettability during the SMT reflow process. It eliminates the risk of cold solder joints.

NPI PCB Footprint Audit & SLA Directive

Board-level assembly demands strict adherence to pad dimensions. Layout errors cause reflow misalignment and battery seating failures. Our engineering rules strictly prohibit using unverified digital mockups. We execute footprint validation exclusively through official [Technical Datasheets]. We also rely on dimensionally controlled [2D Footprint Specs].

Please confirm that our SMT retainer matches your land pattern needs. Engage our Senior NPI Engineering Team for layout verification. Submit your board constraints directly to our technical desk: NPI Engineering Queue. We will dispatch matched, production-ready PDF drawings within 12 working hours.

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