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SMT Battery Clip (AAAA/A27) | Keystone 50 Alternative

Direct Footprint Replacement for Keystone 50 SMT Clips

We engineered this surface-mount battery clip. It serves as a 1:1 footprint replacement for Keystone 50. This clip features a robust U-channel retention architecture. It provides secure clamping for AAAA and A27 cells. We package this component in tape and reel for automated assembly.

  • Mounting Architecture: Surface Mount Technology (SMT)
  • Cell Compatibility: AAAA, A27 (Cylindrical Cells)
  • Dimensional Envelope: 8.17mm Width x 8.15mm Total Height
  • PCB Pad Layout: Direct Match for Keystone 50 (10.16mm Base)
  • Metallurgy: T=0.25mm Spring Steel finished with Nickel Plating

Engineering Datasheet: SMT Battery Clip, Direct Footprint Replacement for Keystone 50

Securing cylindrical cells on FR4 boards requires flat SMT pads. The Jiatel JT-BC-AAAA-KS50 is a direct footprint replacement for Keystone 50. This SMT clip allows hardware engineers to execute seamless board-level integration. You do not need to alter existing PCB pad layouts. You can also keep your current reflow solder stencil designs.

Verified Board-Level Parameters

Target Cross-Reference Direct Footprint Replacement for Keystone 50
Mounting Architecture Surface Mount Technology (SMT)
Bracket Dimensions 8.17±0.38mm (W) x 8.15±0.38mm (Total Height)
PCB Pad Pitch (“L” Dim) 22.48mm (AAAA) | 8.10mm (A27)
Base Pad Footprint 9.10mm Minimum Pad Length
Base Metallurgy T=0.25mm Spring Steel | Nickel Plated

Target Deployments

  • Industrial IoT: SMT sensor nodes utilizing A27 cells.
  • Medical Diagnostics: Compact patient monitoring PCBA modules.
  • Consumer Electronics: High-drain automated assembly devices requiring AAAA power.

Metallurgical Rigidity & Solder Joint Integrity

We stamp the JT-BC-AAAA-KS50 from rigid T=0.25mm Spring Steel. This precise metal thickness provides absolute structural rigidity. The U-channel clamping arms will not yield under constant pressure. We finish the entire assembly with high-density Nickel Plating. This plating maximizes solder paste wettability during the reflow process. It eliminates the risk of cold solder joints on SMT lines.

NPI PCB Footprint Audit & SLA Directive

Board-level assembly demands strict adherence to pad dimensions and axial spacing. Layout errors cause reflow misalignment and battery seating failures. Our engineering rules strictly prohibit using unverified 3D models. We execute footprint validation exclusively through official [Technical Datasheets]. We also rely on dimensionally controlled [2D Footprint Specs].

Please confirm that our SMT clip matches your land pattern needs. Engage our Senior NPI Engineering Team for layout verification. Submit your board constraints directly to our technical desk: NPI Engineering Queue. We will dispatch matched, production-ready PDF drawings within 12 working hours.

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