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SMT Battery Clip (18650/CR123A) | Keystone 254 Alternative

Direct Footprint Replacement for Keystone 254 SMT Clips

We engineered this surface-mount battery clip. It serves as a 1:1 footprint replacement for Keystone 254. This SMT clip features bottom locating pins for PCB alignment. It provides secure retention for 18650 and CR123A lithium cells.

  • Mounting Architecture: Surface Mount Technology (SMT) with Locating Pins
  • Cell Compatibility: 18650, CR123A (Cylindrical Cells)
  • Dimensional Envelope: 16.30mm Width x 17.15mm Height
  • PCB Pad Layout: Direct Match for Keystone 254 (16.00mm Base)
  • Metallurgy: T=0.30mm Spring Steel finished with Nickel Plating

Engineering Datasheet: SMT Battery Clip, Direct Footprint Replacement for Keystone 254

Securing heavy 18650 lithium cells on FR4 boards demands extreme retention force. Automated SMT assembly requires precise component positioning. The Jiatel JT-BC-18650-KS254 is a direct footprint replacement for Keystone 254. This clip features bottom locating pins. These pins prevent lateral shifting during solder paste reflow. You can execute seamless board-level power integration. You do not need to alter existing PCB pad layouts.

Verified Board-Level Parameters

Target Cross-Reference Direct Footprint Replacement for Keystone 254
Mounting Architecture Surface Mount Technology (SMT) with Locating Pins
Base Pad Footprint 16.00mm Length (Requires Ø1.85mm Alignment Holes)
Axial PCB Pitch (“L” Dim) 40.25mm (18650) | 6.85mm (CR123A)
Base Metallurgy T=0.30mm Spring Steel | Nickel Plated

Target Deployments

  • Energy Storage: Battery management system (BMS) boards utilizing 18650 cells.
  • Medical Diagnostics: SMT power modules for portable equipment.
  • Consumer Electronics: High-drain automated assembly devices.

Metallurgical Rigidity & Solder Joint Integrity

We stamp the JT-BC-18650-KS254 from rigid T=0.30mm Spring Steel. This specific formulation guarantees absolute structural rigidity. The U-channel gripping arms prevent cell dislodgement during mechanical impact. The clip will not yield under repeated battery insertion cycles. We finish the assembly with high-density Nickel Plating. This maximizes solder paste wettability across the 16.00mm base. It eliminates the risk of cold solder joints on SMT lines.

NPI PCB Footprint Audit & SLA Directive

Board-level integration demands strict adherence to pad dimensions and alignment holes. Layout errors cause reflow misalignment and seating failures. Our engineering rules strictly prohibit the distribution of unverified digital mockups. We execute structural footprint validation exclusively through official [Technical Datasheets]. We rely on dimensionally controlled [2D Footprint Specs].

Confirm that our SMT clip matches your existing FR4 land pattern. Submit your board constraints directly to our technical desk: NPI Engineering Queue. We will dispatch matched, production-ready PDF drawings within 12 working hours.

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