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SMT Coin Cell Retainer (CR1220/CR1225) | Keystone 3000 Alternative

Direct Footprint Replacement for Keystone 3000 SMT Retainers

We engineered this surface-mount coin cell retainer. It serves as a 1:1 footprint replacement for Keystone 3000. This SMT clip secures Ø12.5mm micro coin cells. It accommodates CR1220 and CR1225 lithium batteries for automated PCB reflow lines.

  • Mounting Architecture: Surface Mount Technology (SMT)
  • Cell Compatibility: CR1220, CR1225, BR1220, BR1225 (Ø12.5mm)
  • Dimensional Envelope: 12.07mm Width x 18.95mm Length x 3.18mm Height
  • PCB Pad Layout: Direct Match for Keystone 3000 (18.95mm Span)
  • Metallurgy: T=0.25mm Phosphor Bronze finished with Nickel Plating

Engineering Datasheet: SMT Coin Cell Retainer, Direct Footprint Replacement for Keystone 3000

Securing micro coin cells on high-density FR4 boards requires precise SMT pad layout matching. The Jiatel JT-BC-1225-KS3000 is a direct footprint replacement for the Keystone 3000. This micro retainer allows hardware engineers to execute seamless board-level integration for CR1220 and CR1225 backup cells. You do not need to alter existing PCB pad coordinates or reflow solder stencil designs.

Verified Board-Level Parameters

Target Cross-Reference Direct Footprint Replacement for Keystone 3000
Mounting Architecture Surface Mount Technology (SMT)
Outer Pad Span 18.95mm Minimum Span
Negative Pad Constraint 4.00mm Square Minimum
Base Metallurgy T=0.25mm Phosphor Bronze | Nickel Plated

Target Deployments

  • Medical Devices: PCBA integration for compact hearing aids and digital thermometers.
  • Consumer Electronics: RTC backup power for key fobs and handheld remotes.
  • Industrial IoT: Miniaturized data logging nodes utilizing CR1225 cells.

Metallurgical Rigidity & Solder Joint Integrity

We stamp the JT-BC-1225-KS3000 from rigid T=0.25mm Phosphor Bronze. This specific material formulation provides excellent spring fatigue resistance for 12.5mm cells. The top clamping arms will not yield under constant battery insertion pressure. We finish the entire assembly with high-density Nickel Plating. This maximizes solder paste wettability across the 18.95mm base span during SMT reflow. It eliminates the risk of cold solder joints.

NPI PCB Footprint Audit & SLA Directive

Board-level assembly demands strict adherence to pad dimensions and coplanarity limits. Layout errors cause reflow misalignment and battery seating failures. Our engineering rules strictly prohibit the distribution of unverified digital mockups. We execute structural footprint validation exclusively through official [Technical Datasheets]. We rely on dimensionally controlled [2D Footprint Specs].

Please confirm that our SMT retainer matches your land pattern constraints. We must deploy our Senior NPI Engineering Team to ensure a 1:1 footprint replacement. Submit your parameters to our technical desk: NPI Engineering Queue. We will dispatch matched, production-ready PDF drawings within 12 working hours.

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