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THM Coin Cell Retainer (CR2450) | Keystone 3009 Alternative

Direct Footprint Replacement for Keystone 3009 THM Retainers

We engineered this through-hole coin cell retainer. It serves as a 1:1 footprint replacement for Keystone 3009. Unlike SMT variants, this THM clip utilizes dual downward pins to provide superior mechanical retention on the PCB. It secures thick, high-capacity Ø24.0mm coin cells, accommodating CR2450 lithium batteries for wave soldering applications.

  • Mounting Architecture: Through-Hole Mount (THM)
  • Cell Compatibility: CR2450 (Ø24.0mm)
  • Dimensional Envelope: 22.61mm Width x 26.90mm Length x 8.94mm Height
  • Axial Pin Pitch: Direct Match for Keystone 3009 (25.40mm Span)
  • Metallurgy: T=0.25mm Phosphor Bronze finished with Nickel Plating

Engineering Datasheet: THM Coin Cell Retainer, Direct Footprint Replacement for Keystone 3009

Securing heavy, high-capacity Ø24.0mm coin cells in high-vibration environments requires robust through-hole integration. The JIATEL JT-BC-2450-KS3009 is a direct footprint replacement for the Keystone 3009. Unlike the SMT 3008 variant, this retainer deploys a dual-pin THM architecture. It provides extreme resistance against lateral shear forces. You can execute seamless board-level integration for 5.0mm thick CR2450 backup cells without altering existing PCB drill hole coordinates.

Verified Board-Level Parameters

Target Cross-Reference Direct Footprint Replacement for Keystone 3009
Mounting Architecture Through-Hole Mount (THM) Dual Pin
Axial Pin Pitch 25.40mm Spread (Requires 2-Ø1.85mm Drills)
Negative Pad Constraint 4.00mm Square Minimum (Center Pad)
Base Metallurgy T=0.25mm Phosphor Bronze | Nickel Plated

Target Deployments

  • Smart Grid Infrastructure: High-capacity primary power for utility meters and remote data loggers.
  • Telematics: Heavy-duty vehicle tracking nodes requiring wave-soldered RTC backup.
  • Industrial Automation: Motor control units exposed to constant mechanical shock.

Metallurgical Rigidity & Wave Soldering Integrity

We stamp the JT-BC-2450-KS3009 from rigid T=0.25mm Phosphor Bronze. The top clamping arms maintain continuous pressure on the heavy CR2450 cells, preventing voltage drop during mechanical impact. We finish the THM tails with high-density Nickel Plating. This maximizes wave solder wettability across the 25.40mm pin layout. It eliminates the risk of cold solder joints and physical detachment.

NPI PCB Footprint Audit & SLA Directive

Through-hole integration demands strict adherence to pin pitch dimensions and drill tolerances. Layout errors cause pin bending and wave soldering failures. Our engineering rules strictly prohibit the distribution of unverified digital mockups. We execute structural footprint validation exclusively through official [Technical Datasheets]. We rely on dimensionally controlled [2D Footprint Specs].

Confirm that our THM retainer matches your FR4 drill pattern. We must deploy our Senior NPI Engineering Team to ensure a 1:1 footprint replacement. Submit your board constraints directly to our technical desk: NPI Engineering Queue. We will dispatch matched, production-ready PDF drawings within 12 working hours.

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