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SMT Battery Contact (AA/CR2) | Keystone 57 Alternative

Direct Footprint Replacement for Keystone 57 SMT Contacts

We engineered this surface-mount contact as a 1:1 footprint replacement for Keystone 57. It provides a secure interface for AA and CR2 cells. We package these contacts in tape and reel for automated assembly.

  • Mounting Architecture: Surface Mount Technology (SMT)
  • Cell Compatibility: AA, CR2 (Cylindrical Cells)
  • Dimensional Envelope: 6.35mm Width x 12.26±0.30mm Height
  • PCB Pad Layout: Direct Match for Keystone 57 (15.57mm Base)
  • Metallurgy: T=0.25mm Spring Steel finished with Nickel Plating
Jiatel P/N

JT-BCAA557

Battery Compatibility 

AA,CR2,CR123A

PCB Mount Orientation

NONE

Mounting

Surface Mount

Material

Mn Spring

Surface Plating

Nickle 100μ“ or Tin Plating

Package

Bulk
Tape & Reel

Engineering Datasheet: SMT Battery Contact, Direct Footprint Replacement for Keystone 57

Securing power for cylindrical cells on FR4 boards requires flat SMT pads. The Jiatel JT-BC-AA-KS57 is a 1:1 direct footprint replacement for Keystone 57. This SMT contact allows hardware engineers to execute seamless board-level integration. You do not need to alter existing PCB pad layouts. You also keep your current solder stencil designs intact.

Verified Board-Level Parameters

Target Cross-Reference Direct Footprint Replacement for Keystone 57
Mounting Architecture Surface Mount Technology (SMT)
PCB Pad Pitch (“L” Dim) 48.30mm (AA) | 24.60mm (CR2)
Base Pad Footprint 15.57mm Minimum Pad Length
Base Metallurgy T=0.25mm Spring Steel | Nickel Plated

Target Deployments

  • Industrial IoT: SMT sensor nodes utilizing CR2 lithium cells.
  • Medical Diagnostics: Compact patient monitoring PCBA modules.
  • Consumer Electronics: High-drain automated assembly devices.

Metallurgical Rigidity & Solder Joint Integrity

We stamp the JT-BC-AA-KS57 from rigid T=0.25mm Spring Steel. This precise metal thickness provides absolute structural rigidity. The contact dimple will not yield under constant axial pressure. We finish the entire assembly with high-density Nickel Plating. This plating maximizes solder paste wettability during the reflow process. It eliminates the risk of cold solder joints on your SMT line.

NPI PCB Footprint Audit & SLA Directive

Board-level assembly demands strict adherence to pad dimensions and axial spacing. Layout errors cause reflow misalignment and battery fit issues. Our engineering rules strictly prohibit using unverified 3D models for layout checks. We execute footprint validation exclusively through official [Technical Datasheets]. We also rely on dimensionally controlled [2D Footprint Specs].

Please confirm that our SMT contact matches your land pattern needs. You can do this by engaging our Senior NPI Engineering Team. Submit your board constraints directly to our technical desk: NPI Engineering Queue. We will dispatch matched, production-ready PDF drawings within 12 working hours.

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