Jiatel Electronics - Custom Pogo Pin and Wire Harness Manufacturer

Side-Mounted SMT Pogo Pin 4.0×10.0mm (Flat Barrel) | Mill-Max Alternative

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Flat-Barrel Side-Mounted Spring Contact for Z-Axis Bypassing

A heavy-duty horizontal surface-mount interconnect engineered with dual precision-milled flats (3.10mm width) to facilitate parallel board-to-board power mating, completely bypassing vertical height constraints.

  • Orientation: Side-Mounted / Horizontal SMT
  • Mechanical Envelope: Ø 4.0mm (3.10mm Flats) x 10.0mm Length
  • Kinematic Travel: 1.5mm Working Stroke / 100gf Max Force
  • Power Integrity: DC 12V / 1.0A Continuous Load
  • Thermal Rating: -30°C to +85°C
Current Rating

1A

Durability

10,000 Cycles

Mechanical Architecture: Flat-Barrel Side-Mounted SMT

Power distribution frameworks in modular industrial systems frequently lack the vertical clearance required for top-entry spring contacts. The Jiatel 4.0×10.0mm series resolves this by acting as a 1:1 mechanical alternative for heavy-duty side-mounted pogo pins. Unlike standard cylindrical barrels that are prone to rolling during automated placement, this interconnect utilizes a straight Ø 4.0mm barrel featuring dual precision-milled flats measuring 3.10mm across. By orienting these flats parallel to the PCB, mating forces are directed horizontally. The calibrated 1.5mm compression stroke absorbs lateral tolerances, ensuring an unbroken 1.0A electrical path without adding Z-axis overhead to the enclosure.

1.0 Electro-Mechanical Specifications

Parameter Engineering Limit
Dimensional Footprint Ø 4.00±0.03mm Barrel (3.10±0.05mm Flats) | 10.00±0.15mm Length
Kinematic Deflection 1.5mm Working Stroke | 100gf Max Spring Force
Electrical Path Capacity DC 12V | 1.0A Continuous Load
Dynamic Impedance ≤ 30mΩ Initial Max | ≤ 60mΩ Post-Test Max
Dielectric & Insulation 100V at 60HZ Withstanding | 100MΩ Min Insulation
Base Metallurgy Brass Plated over 50-120u” Ni | SUS Spring

Anti-Roll Geometry & Lateral Shear Resistance

Side-mounted connectors endure continuous lateral shear forces throughout the mating cycle. To neutralize solder joint fatigue, the heavy 4.0mm brass barrel is engineered with a 3.10mm flat mounting footprint. This expanded surface area maximizes capillary action during reflow, creating a robust solder fillet that anchors the component securely against horizontal pressure. Verified for a minimum of 10,000 mechanical cycles, this interconnect survives high-vibration modular deployments without pad delamination.

NPI Layout Audit & SLA Directive

Horizontal surface-mounting demands absolute precision in pad alignment to counter lateral insertion forces. Our engineering directive strictly prohibits the deployment of unverified 3D digital mockups. We execute structural matching and footprint validation exclusively through official [Technical Datasheets] and dimensionally controlled [2D Footprint Specs].

To confirm that this 4.0×10.0mm flat-barrel configuration integrates flawlessly into your board layout, submit your pad constraints directly to our technical desk: NPI Engineering Queue. We guarantee the dispatch of matched, production-ready PDF drawings within 12 working hours.

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