High-Reliability Through-Hole Spring-Loaded Electrical Contact Pins
Our through-hole spring-loaded electrical contact pins are precision-engineered to provide exceptionally stable, long-cycle temporary or permanent board-level interconnect solutions. By deploying a robust DIP through-hole architecture, these pogo pin contacts deliver significantly higher mechanical shear resistance and anchoring strength than standard surface-mount setups, making them the premier choice for docking stations, high-use battery charging terminals, and modular daughterboard interfaces.
- Micro-Profile & Durability Alignment: Available in ultra-low profile configurations starting at a minimum vertical height of 1.33mm, these spring-loaded contact DIP pins bridge the gap between compact spatial envelopes and rugged mechanical rigidity. The internal precision SUS304 springs supply a uniform contact force of 40g±10g at standard working stroke, preventing micro-intermittent power loss and resistance drift under intense transport vibration profiles.
- Premium Metallurgy & Plating Thickness: Fabricated from high-purity C3604 Brass or Beryllium Copper base alloys, the plungers feature standard 3u” Gold plating over Nickel (customizable up to 30u” Au callouts) to yield exceptional corrosion defense and an optimized electrical path (contact resistance tightly managed at ≤30 mΩ max).
Jiatel Standard Engineering Specifications
For high-speed Bill-of-Materials (BOM) matching, component specifiers can directly audit our verified technical baseline parameters:
| Interconnect Parameter Group | Jiatel Standard Value | Downstream Performance Advantage |
|---|---|---|
| Mounting Geometry Style | Through-Hole (DIP) Pins / Solder Cup | Maximum board shear bond strength |
| Minimum Component Height | 1.33 mm Vertical Envelope | Ultra-low profile multi-layer trace allowance |
| Continuous Rated Current | 1A – 5A (Custom scalable up to 15A) | High current power rail distribution |
| Full Compression Travel | 1.40 mm Stroke Length | Reliable wiping action and pad engagement |
| Base Alloy Metallurgy | Machined C3604 Brass / Be-Cu Plunger | Excellent conductivity and cyclical fatigue lifecycle |
Audited Drawing Library & Senior NPI Engineering Queue
Automated high-speed interconnect picking systems require absolute component coplanarity and micrometer-level footprint pad validation. To enforce strict version control and protect our clients from footprint routing faults, Jiatel restricts open 3D step log downloads on public servers. Our technical team distributes mass-production-ready drawings directly instead.
If your project demands verified 1:1 alternatives to global Tier-1 layouts (such as Mill-Max, Harwin, or Preci-Dip configurations), please route your dimensional boundaries and pin count array parameters directly to our engineering queue for immediate retrieval:
SLA Delivery Commitment: Jiatel officially guarantees that checked, production-ready [Technical Datasheets] and [2D Footprint Specs] will be dispatched in verified PDF format within 12 hours after registration in our NPI Engineering Queue.
Global Compliance & Industrial Reliability Parameters
- Environmental Standards: Fully RoHS & REACH compliant, passing strict toxic chemical screening for direct deployment into North American and European industrial machinery supply chains.
- Versatile Sector Adaptability: Rigorously tested and stable across smart home infrastructure, automated EV battery testing fixtures, marine instruments, and portable medical diagnostic telemetry.
- Rapid Manufacturing Delivery: Custom component tooling molds are tightly managed under US$2,000 with pre-production initial samples dispatched in 25 days following signed print approvals.
