Jiatel Electronics - Custom Pogo Pin and Wire Harness Manufacturer

Extended-Stroke SMT Pogo Pin 2.0×6.5mm (1.6mm Travel) | Mill-Max Alternative

High-Tolerance Surface Mount Spring Contact for Variable Gaps

We engineered this 2.0mm diameter SMT interconnect with a 6.5mm resting profile and a generous 1.6mm working stroke. It is explicitly designed to absorb severe Z-axis co-planarity variations in parallel board-to-board arrays.

  • [ Mounting ] SMT (Surface Mount Technology)
  • [ Mechanical Envelope ] Ø 2.0mm Barrel x 6.5mm Overall Height
  • [ Kinematic Travel ] 1.6mm Extended Deflection Stroke
  • [ Power Integrity ] DC 12V / 1.0A–1.65A Continuous Load
Current Rating

1A

Durability

10,000 Cycles

Mechanical Cross-Reference: 6.5mm SMT Pin with Extended Travel

Modular industrial enclosures, docking stations, and battery management systems frequently encounter unpredictable Z-axis mating tolerances due to chassis flex or component stack-up variance. The Jiatel 2.0×6.5mm series resolves these structural bottlenecks by acting as a 1:1 mechanical drop-in alternative for extended-stroke legacy pogo pins. Operating from a 6.5mm resting height, this surface-mount contact integrates a deep 1.6mm compression stroke. This generous travel range dynamically absorbs mechanical shifts and vibration, preventing electrical cutoffs without inducing excessive stress on the PCB pads.

Core Electro-Mechanical Parameters

Dimensional Footprint
Ø 2.0mm Barrel | 6.5mm Resting Height
Kinematic Deflection
1.6mm Extended Working Stroke
Electrical Path Capacity
DC 12V | 1.0A to 1.65A Continuous
Dynamic Impedance
≤ 25mΩ Initial Maximum Resistance
Thermal Endurance
-40°C to +150°C Operational Range
Lifecycle Validation
10,000+ Mating Cycles Minimum

Metallurgical Stability Under Deep Compression

Accommodating a massive 1.6mm deflection within a 6.5mm barrel drastically increases internal friction. To prevent signal degradation and internal spring seizing, the precision-turned brass plunger and barrel are sealed with a heavy gold-plated layer over a nickel diffusion barrier. Our lab data confirms this surface engineering maintains mechanical resilience and locks dynamic resistance below 25mΩ across the entire 10,000-cycle lifespan. The component is explicitly verified to withstand reflow profiles up to +150°C without losing structural integrity.

NPI SMT Coplanarity & Integration Protocol

Integrating extended-stroke interconnects on high-density PCBs requires absolute control over solder pad alignment to prevent wicking and reflow tilt. Our engineering directive strictly prohibits the deployment of unverified digital 3D mockups. We execute structural matching and footprint validation exclusively through official [Technical Datasheets] and dimensionally verified [2D Footprint Specs].

To confirm that our 2.0×6.5mm SMT configuration integrates flawlessly into your board layout, deploy our Senior NPI Engineering Team. Submit your structural constraints directly to our technical desk: NPI Engineering Queue.

* SLA Guarantee: Matched, production-ready PDF drawings dispatched within 12 working hours of submission.

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