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SMT Coin Cell Retainer (CR2450) | Keystone 3008 Alternative

Direct Footprint Replacement for Keystone 3008 SMT Retainers

We engineered this surface-mount coin cell retainer. It serves as a 1:1 footprint replacement for Keystone 3008. This SMT clip secures thick Ø24.0mm coin cells. It accommodates high-capacity CR2450 lithium batteries for automated PCB reflow lines.

  • Mounting Architecture: Surface Mount Technology (SMT)
  • Cell Compatibility: CR2450 (Ø24.0mm)
  • Dimensional Envelope: 22.61mm Width x 35.51mm Length x 5.84mm Height
  • PCB Pad Layout: Direct Match for Keystone 3008 (35.51mm Span)
  • Metallurgy: T=0.25mm Phosphor Bronze finished with Nickel Plating

Engineering Datasheet: SMT Coin Cell Retainer, Direct Footprint Replacement for Keystone 3008

Securing heavy, high-capacity Ø24.0mm coin cells on FR4 boards requires robust SMT pad layouts and high terminal retention force. The JIATEL JT-BC-2450-KS3008 is a direct footprint replacement for the Keystone 3008. This retainer allows hardware engineers to execute seamless board-level integration for CR2450 backup cells. You do not need to alter existing PCB pad coordinates or reflow solder stencil designs.

Verified Board-Level Parameters

Target Cross-Reference Direct Footprint Replacement for Keystone 3008
Mounting Architecture Surface Mount Technology (SMT)
Outer Pad Span 35.51mm Minimum Span
Negative Pad Constraint 4.00mm Square Minimum (Center Pad)
Base Metallurgy T=0.25mm Phosphor Bronze | Nickel Plated

Target Deployments

  • Smart Metering: High-capacity primary power for utility meters.
  • Industrial IoT: Long-life RTC backup for remote data loggers.
  • Medical Devices: Reliable power retention for portable diagnostic hardware.

Metallurgical Rigidity & Solder Joint Integrity

We stamp the JT-BC-2450-KS3008 from rigid T=0.25mm Phosphor Bronze. This specific material formulation provides excellent spring fatigue resistance for 5.0mm thick CR2450 cells. The top clamping arms will not yield under the significant insertion pressure of heavy batteries. We finish the entire assembly with high-density Nickel Plating. This maximizes solder paste wettability across the wide 35.51mm base span during SMT reflow. It eliminates the risk of cold solder joints and pad delamination.

NPI PCB Footprint Audit & SLA Directive

Board-level assembly demands strict adherence to pad dimensions and coplanarity limits. Layout errors cause reflow misalignment and battery seating failures. Our engineering rules strictly prohibit the distribution of unverified digital mockups. We execute structural footprint validation exclusively through official [Technical Datasheets]. We rely on dimensionally controlled [2D Footprint Specs].

Confirm that our SMT retainer matches your land pattern constraints. We must deploy our Senior NPI Engineering Team to ensure a 1:1 footprint replacement. Submit your parameters directly to our technical desk: NPI Engineering Queue. We will dispatch matched, production-ready PDF drawings within 12 working hours.

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